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AG thermal pads without glue are used where the use of thermal paste is not possible. They are very flexible. They feature high compressibility which ensures good fitting to components that require cooling. They do not contain glue.
Applications:
- Between heat-generating conductors and the heat sink
- Filling air gaps between the computer's motherboard and the heatsink
- In LED lighting systems
Specification:
- Manufacturer: AG Thermal Pastes
- Dimensions: 41.5x28x3 mm
- Thermal conductivity: 1.5W/mK
- Quantity: 1
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